CML - ETP - THE QUALITY CHOICE |
| CML - ETP From Quality Materials to Quality
Solutions |
Copper busbar in electrical applications requires several key electrical and mechanical properties including high electrical conductivity, good formability and surface flatness. These key properties rely heavily upon quality of raw material and consistency of production process.
Through a state-of-the-art production process specifically designed for copper busbar production, CML-ETP is cast from the highest purity copper cathode available from mines and smelters
(LME registered brand grade A only). The Right Material and the Right Production Process make CML-ETP perfect for all technical and economical solutions to any electrical applications dealing with copper busbar and busduct. In addition, CML-ETP also offers excellent thermal conductivity, hence it suits well with heat exchanged applications where space is limited such as CPU-heatsink. |
| Quality Conductivity |
Electrical conductivity of any electrical conductor is dependent upon the purity of conductor. CML-ETP is cast from pure copper cathodes with purity of 99.99%. The highest purity raw material enables CML-ETP to offer very high conductivity compared to other standard copper busbar. Electrical conductivity of CML-ETP is as high as 101% IACS (International Annealed Copper Standard), while standard copper busbar can offer a minimum of only 98.0% IACS. |
| Quality Formability |
Formability is a term used to express how good copper busbar can be bent without cracking. Formability is expressed as the minimum bend radius (R) divided by the thickness (t). The smaller the R/t, the better is the formability. The formability of copper busbar is a result of grain size structure of the conductor itself. The CML-ETP process produces the finest copper grain size structure so that CML-ETP offers superior formability compared with any other standard copper busbar. |
| Quality Flatness |
Flatness of
copper busbar is vital to jointing efficiency. The
better flatness also reduces machining works required
during preparation of jointing surface. CML-ETP has
lower than 50 µm flatness which is more than capable of
producing superior jointing efficiency. |
| Quality |
Right Quality With high copper purity 99.99% raw materials, computerized control system and special process to homogenize billets' temperature (soaking chamber), quality of CML-ETP is extremely stable. Figure 4 illustrates percentage of copper content for standard copper busbar and CML-ETP copper busbar. |
| Quality Production Process |
CML-ETP is produced from a state-of-the-art production process specifically designed to produce copper busbar. The process offers the finest copper grain size structure and its surface is free from oxidation and discoloration. Production process of CML-ETP is very flexible.
It can switch to a new size of busbar within 20 minutes so that CML-ETP can be available in small quantities but variety in sizes. This right combination makes CML-ETP available in a shorter production time, faster in delivery, and, hence, better in cost management. |
| Quality Property for Welding and Brazing |
CML-ETP can be jointed by soldering, brazing, oxyacetylene welding and gas shield arc welding without adverse effect. |
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The CML-ETP production technology produces copper of
superior quality |
